The infrared detector and metalens^® are both manufactured using semiconductor processes. Taking such advantage, MetaLenX launches WLPmeta™, a wafer level packaging thermal imaging module；

Instead of the traditional form of detector and lens assembly, WLPmeta™ products use semiconductor wafer level packaging process to complete the whole process of detector+lensing system+assembly in a single semiconductor production line,  having the advantage in yield rate and cost.