MetaLenX proposes specific semicondutor process for metalens® after a long time of optimization, based on which the mass producible metalenses are validated.

MetaLenX uses e-beam lithography to optimize the performance before mass production and delivery to ensure reliability.

MetaLenX proposes anti-reflection coating via several advanced techniques to greatly enhance the transimittance of broad band metalenses.

For special metasurface fabrication and bonding, MetaLenX has the corresponding methods, such as curve substrate lithography, wafer level bonding for metasurfaces, and stepped substrate lithography, etc.